Features 特征

•  1 component resin 1组分树脂

•  UV Curable 紫外线固化

•  Easily peelable after curing 固化后易于剥离

•  Soft texture after curing 固化后质地柔软

Applicable substrate 适用基材

PCB Substrate, Metal etc. PCB基板，金属等

Curing Condition 固化条件

UV Curing (365nm, 2000mJ/cm2 (In Nitrogen Atmosphere)) for 1~2 minuites

UV固化（365nm，2000mJ / cm2（在氮气氛中））1〜2分钟